Horizontal inline sputtering system
Description of a typical application
The term sputtering is a physical process in which atoms are released from a solid (target) by bombardment with high-energy ions (predominantly noble gas ions) and then transferred to the gas phase.
The term sputtering is usually understood to mean only the sputter deposition, a high-vacuum-based coating technique belonging to the group of PVD processes. Furthermore, sputtering is used in surface physics as a cleaning method for the preparation of high-purity surfaces and as a method for analyzing the chemical composition of surfaces.
The DELTALINE series is a very flexible R & D and production system for such thin-film processes.
Substrate weight, max.
High vacuum pumps
Power per cathode
No. of process chambers
Process chamber material
Dimensions (L x W x H), ca.
* Other machine sizes and specifications on request
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