Loading and unloading station on one or both sides
Pre-treatment by glowing, heating and etching
DC, pulsed DC, MF and RF sputtering
Precise drive system with positioning function
Sweep mode, run mode, stationary mode
Replaceable cathode modules planar & rotatable
Process sequence fully automatic
Recipe management and process visualization
Data management for process documentation
Effective vacuum pump system
System-specific substrate sizes:
1000 mm x 400 mm x 35 mm
1000 mm x 600 mm x 35 mm
1000 mm x 800 mm x 35 mm
Description of a typical application
The term sputtering is a physical process in which atoms are released from a solid (target) by bombardment with high-energy ions (predominantly noble gas ions) and then transferred to the gas phase.
The term sputtering is usually understood to mean only the sputter deposition, a high-vacuum-based coating technique belonging to the group of PVD processes. Furthermore, sputtering is used in surface physics as a cleaning method for the preparation of high-purity surfaces and as a method for analyzing the chemical composition of surfaces.
The DELTALINE series is a very flexible R & D and production system for such thin-film processes.
DELTALINE 10X0H - Technical Data
1000 x 400 x 35 mm - (DELTALINE 1040H) 1000 x 600 x 35 mm - (DELTALINE 1060H) 1000 x 800 x 35 mm - (DELTALINE 1080H)
Substrate weight, max.
0.2 ... 10 m/min
High vacuum pumps
20 ... 350 °C
< 2 x 10^-6 mbar
Planar / tube cathode
DC / DC pulsed / MF / RF
Power per cathode
5 ... 20 kW
Metals / alloys / multilayers / oxides
No. of process chambers
1 ... 3
Process chamber material
stainless steel 1.4301
Dimensions (L x W x H), ca.
5900* x 2500 x 2000 mm - (DELTALINE 1040H) 5900* x 3000 x 2000 mm - (DELTALINE 1060H) 5900* x 3500 x 2000 mm - (DELTALINE 1080H) * Length depends on configuration
* Other machine sizes and specifications on request